wehewehe:

ʻO ka pāpaʻi thyristor chip he ʻano o ka thyristor chip, a he ʻehā-layer semiconductor structure me ʻekolu junctions PN, me ka puka, cathode, silicon wafer a me ka anode.ʻO ka cathode, ka wafer silika a me ka anode he ʻano palahalaha a huinaha.Hoʻopili ʻia kekahi ʻaoʻao o ka wafer silicon me ka cathode, hoʻopili ʻia kekahi ʻaoʻao me ka anode, wehe ʻia kahi puka alakaʻi ma ka cathode, a hoʻonohonoho ʻia ka puka i loko o ka lua.Hoʻopili ʻia ka ʻīpuka, ka cathode a me ka ʻili anode me nā mea solder.ʻO nā kaʻina hana nui: ka hoʻomaʻemaʻe wafer silicon, diffusion, oxidation, photolithography, corrosion, passivation protection, metallization, hoʻāʻo a me ka dicing.

Kōmike hana:

• ITAV=25A~200A,

• VRRM=1600V

ʻAno puka:

• Puka Kihi Triangle: ITAV=25A~60A

• Puka Waena Poe: ITAV=110A~200A

Kapili:

• Mesa pālua

• ʻO ka anode metala he nui-layer TiNiAg a i ʻole Al+TiNiAg

• ʻO ka papa cathode metallized ʻo Al a i ʻole TiNiAg

Nā hiʻohiʻona:

• Hoʻolaha ʻia ka alumini hoʻoheheʻe, haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa ma ka mokuʻāina, ka uila pale kiʻekiʻe

• ʻO ke ʻano huina ʻino ʻelua

• Mea palekana Passivation: SIPOS+GLASS+LTO

• IL haʻahaʻa a me ka hoʻohana ākea

• ʻO ka papa alumini mānoanoa a me ka hoʻopaʻa maʻalahi

• ʻOi aku ka maikaʻi o ka hoʻoulu ʻana