ʻO ka puʻupuʻu diode rectifier i hana ʻia e RUNAU Electronics i hoʻolauna mua ʻia e ka GE processing standard a me ka ʻenehana e hoʻokō nei i ka maʻamau noi noi USA a kūpono ʻia e nā mea kūʻai aku o ka honua.Hōʻike ʻia ia i nā hiʻohiʻona kūpaʻa wela wela, ke ola lōʻihi, ka volta kiʻekiʻe, ka nui o kēia manawa, ka hoʻololi ʻana i ke kaiapuni ikaika, a me nā mea ʻē aʻe.Loaʻa ka koho kūlike o nā ʻāpana chips e hāʻawi ʻia e like me ke koi noi.
ʻĀpana:
Anawaena mm | mānoanoa mm | Voltage V | Cathode Out Dia. mm | ʻO Tjm ℃ |
17 | 1.5±0.1 | ≤2600 | 12.5 | 150 |
23.3 | 1.95±0.1 | ≤2600 | 18.5 | 150 |
23.3 | 2.15±0.1 | 4200-5500 | 16.5 | 150 |
24 | 1.5±0.1 | ≤2600 | 18.5 | 150 |
25.4 | 1.4-1.7 | ≤3500 | 19.5 | 150 |
29.72 | 1.95±0.1 | ≤2600 | 25 | 150 |
29.72 | 1.9-2.3 | 2800-5500 | 23 | 150 |
32 | 1.9±0.1 | ≤2200 | 27.5 | 150 |
32 | 2±0.1 | 2400-2600 | 26.3 | 150 |
35 | 1.8-2.1 | ≤3500 | 29 | 150 |
35 | 2.2±0.1 | 3600-5000 | 27.5 | 150 |
36 | 2.1±0.1 | ≤2200 | 31 | 150 |
38.1 | 1.9±0.1 | ≤2200 | 34 | 150 |
40 | 1.9-2.2 | ≤3500 | 33.5 | 150 |
40 | 2.2-2.5 | 3600-6500 | 31.5 | 150 |
45 | 2.3±0.1 | ≤3000 | 39.5 | 150 |
45 | 2.5±0.1 | 3600-4500 | 37.5 | 150 |
50.8 | 2.4-2.7 | ≤4000 | 43.5 | 150 |
50.8 | 2.8±0.1 | 4200-5000 | 41.5 | 150 |
55 | 2.4-2.8 | ≤4500 | 47.7 | 150 |
55 | 2.8-3.1 | 5200-6500 | 44.5 | 150 |
63.5 | 2.6-3.0 | ≤4500 | 56.5 | 150 |
63.5 | 3.0-3.3 | 5200-6500 | 54.5 | 150 |
70 | 2.9-3.1 | ≤3200 | 63.5 | 150 |
70 | 3.2±0.1 | 3400-4500 | 62 | 150 |
76 | 3.4-3.8 | ≤4500 | 68.1 | 150 |
89 | 3.9-4.3 | ≤4500 | 80 | 150 |
99 | 4.4-4.8 | ≤4500 | 89.7 | 150 |
ʻIkepili ʻenehana:
Hāʻawi ʻo RUNAU Electronics i nā ʻāpana semiconductor mana o ka diode rectifier a me ka diode welding.
1. Haʻahaʻa haʻahaʻa ma ka moku'āina hāʻule uila
2. E hoʻohana ʻia ka metallization gula e hoʻomaikaʻi i ka waiwai conductive a me ka wela.
3. Mesa pale papa ʻelua
Manaʻo kōkua:
1. I mea e hoʻomau ai i ka hana ʻoi aku ka maikaʻi, e mālama ʻia ka chip i loko o ka nitrogen a i ʻole ke kūlana vacuum i mea e pale ai i ka hoʻololi ʻana o ka voltage i hana ʻia e ka oxidation a me ka haʻahaʻa o nā ʻāpana molybdenum.
2. E hoʻomaʻemaʻe mau i ka ʻili o ka chip, e ʻoluʻolu e hoʻokomo i nā mīkina lima a mai hoʻopā i ka chip me nā lima ʻole
3. E hana pono i ke kaʻina hana.Mai hōʻino i ka ʻili o ka resin a me ka papa alumini ma ka ʻāpana pole o ka puka a me ka cathode
4. I ka hoʻāʻo ʻana a i ʻole encapsulation, e ʻoluʻolu e hoʻomaopopo ʻo ka parallelism, flatness a me ka hoʻopaʻa ʻana i ka ikaika o ka mea paʻa e pono e kūlike me nā kūlana i kuhikuhi ʻia.ʻO ka hoʻohālikelike maikaʻi ʻole e hopena i ke kaomi ʻole a me ka pōʻino chip ma ka ikaika.Inā ʻoi aku ka ikaika o ka hoʻopili ʻana, e pōʻino maʻalahi ka chip.Inā liʻiliʻi loa ka ikaika o ka clamp, e hoʻopilikia ka hoʻopili maikaʻi ʻole a me ka wela wela i ka noi.
5. Pono e hoʻopili ʻia ka poloka kaomi e pili ana me ka ʻili cathode o ka chip
Manaʻo Clamp Force
Ka nui o nā chips | Manaʻo Clamp Force |
(KN)±10% | |
Φ25.4 | 4 |
Φ30 a i ʻole Φ30.48 | 10 |
Φ35 | 13 |
Φ38 a i ʻole Φ40 | 15 |
Φ50.8 | 24 |
Φ55 | 26 |
Φ60 | 28 |
Φ63.5 | 30 |
Φ70 | 32 |
Φ76 | 35 |
Φ85 | 45 |
Φ99 | 65 |