Hoʻoponopono diode Chip

ʻO ka wehewehe pōkole:

Kūlana:

Hoʻāʻo ʻia kēlā me kēia chip ma TJM , ua papa loa ia ka nana wale ana.

Kūlike maikaʻi o nā ʻāpana chips

 

Nā hiʻohiʻona:

Haʻahaʻa haʻahaʻa haʻahaʻa i mua

Ke kū'ē ikaika i ka wela wela

ʻO ka mānoanoa o ka papa alumini cathode ma luna o 10µm

Pale papalua ma ka mesa


Huahana Huahana

Huahana Huahana

Hoʻopololei Diode Chip

ʻO ka puʻupuʻu diode rectifier i hana ʻia e RUNAU Electronics i hoʻolauna mua ʻia e ka GE processing standard a me ka ʻenehana e hoʻokō nei i ka maʻamau noi noi USA a kūpono ʻia e nā mea kūʻai aku o ka honua.Hōʻike ʻia ia i nā hiʻohiʻona kūpaʻa wela wela, ke ola lōʻihi, ka volta kiʻekiʻe, ka nui o kēia manawa, ka hoʻololi ʻana i ke kaiapuni ikaika, a me nā mea ʻē aʻe.Loaʻa ka koho kūlike o nā ʻāpana chips e hāʻawi ʻia e like me ke koi noi.

ʻĀpana:

Anawaena
mm
mānoanoa
mm
Voltage
V
Cathode Out Dia.
mm
ʻO Tjm
17 1.5±0.1 ≤2600 12.5 150
23.3 1.95±0.1 ≤2600 18.5 150
23.3 2.15±0.1 4200-5500 16.5 150
24 1.5±0.1 ≤2600 18.5 150
25.4 1.4-1.7 ≤3500 19.5 150
29.72 1.95±0.1 ≤2600 25 150
29.72 1.9-2.3 2800-5500 23 150
32 1.9±0.1 ≤2200 27.5 150
32 2±0.1 2400-2600 26.3 150
35 1.8-2.1 ≤3500 29 150
35 2.2±0.1 3600-5000 27.5 150
36 2.1±0.1 ≤2200 31 150
38.1 1.9±0.1 ≤2200 34 150
40 1.9-2.2 ≤3500 33.5 150
40 2.2-2.5 3600-6500 31.5 150
45 2.3±0.1 ≤3000 39.5 150
45 2.5±0.1 3600-4500 37.5 150
50.8 2.4-2.7 ≤4000 43.5 150
50.8 2.8±0.1 4200-5000 41.5 150
55 2.4-2.8 ≤4500 47.7 150
55 2.8-3.1 5200-6500 44.5 150
63.5 2.6-3.0 ≤4500 56.5 150
63.5 3.0-3.3 5200-6500 54.5 150
70 2.9-3.1 ≤3200 63.5 150
70 3.2±0.1 3400-4500 62 150
76 3.4-3.8 ≤4500 68.1 150
89 3.9-4.3 ≤4500 80 150
99 4.4-4.8 ≤4500 89.7 150

ʻIkepili ʻenehana:

Hāʻawi ʻo RUNAU Electronics i nā ʻāpana semiconductor mana o ka diode rectifier a me ka diode welding.
1. Haʻahaʻa haʻahaʻa ma ka moku'āina hāʻule uila
2. E hoʻohana ʻia ka metallization gula e hoʻomaikaʻi i ka waiwai conductive a me ka wela.
3. Mesa pale papa ʻelua

Manaʻo kōkua:

1. I mea e hoʻomau ai i ka hana ʻoi aku ka maikaʻi, e mālama ʻia ka chip i loko o ka nitrogen a i ʻole ke kūlana vacuum i mea e pale ai i ka hoʻololi ʻana o ka voltage i hana ʻia e ka oxidation a me ka haʻahaʻa o nā ʻāpana molybdenum.
2. E hoʻomaʻemaʻe mau i ka ʻili o ka chip, e ʻoluʻolu e hoʻokomo i nā mīkina lima a mai hoʻopā i ka chip me nā lima ʻole
3. E hana pono i ke kaʻina hana.Mai hōʻino i ka ʻili o ka resin a me ka papa alumini ma ka ʻāpana pole o ka puka a me ka cathode
4. I ka hoʻāʻo ʻana a i ʻole encapsulation, e ʻoluʻolu e hoʻomaopopo ʻo ka parallelism, flatness a me ka hoʻopaʻa ʻana i ka ikaika o ka mea paʻa e pono e kūlike me nā kūlana i kuhikuhi ʻia.ʻO ka hoʻohālikelike maikaʻi ʻole e hopena i ke kaomi ʻole a me ka pōʻino chip ma ka ikaika.Inā ʻoi aku ka ikaika o ka hoʻopili ʻana, e pōʻino maʻalahi ka chip.Inā liʻiliʻi loa ka ikaika o ka clamp, e hoʻopilikia ka hoʻopili maikaʻi ʻole a me ka wela wela i ka noi.
5. Pono e hoʻopili ʻia ka poloka kaomi e pili ana me ka ʻili cathode o ka chip

Manaʻo Clamp Force

Ka nui o nā chips Manaʻo Clamp Force
(KN)±10%
Φ25.4 4
Φ30 a i ʻole Φ30.48 10
Φ35 13
Φ38 a i ʻole Φ40 15
Φ50.8 24
Φ55 26
Φ60 28
Φ63.5 30
Φ70 32
Φ76 35
Φ85 45
Φ99 65

  • Mua:
  • Aʻe:

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